SUMMARY: AI-driven data centers demand advanced HVAC systems to handle the immense heat output from high-performance computing and liquid cooling technologies. Facility owners must prioritize energy efficiency, redundancy, and precise temperature control to maintain uptime and optimize costs. Partnering with an experienced mechanical contractor like Donnelly Mechanical ensures systems are designed and maintained for the unique challenges of AI infrastructure.

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As artificial intelligence (AI) continues to shape industries and redefine technology, the demand for high-performance computing (HPC) infrastructure is soaring. AI data centers are at the heart of this evolution — housing powerful processors that run complex machine learning models and data analytics at lightning speed. But with that performance comes a major challenge: heat.

Traditional air-based cooling methods are no longer sufficient to keep up with the heat output of modern AI workloads. To maintain reliability, efficiency, and uptime, facility owners are turning to advanced HVAC and cooling strategies, especially liquid cooling systems like Direct-to-Chip Cooling, to future-proof their data centers.

The Growing Demand for Efficient AI Data Center Cooling

ai data centersAI-driven workloads have dramatically changed how data centers operate. Rack densities that once averaged around 5–10 kW are now reaching 20 kW or more, with HPC and AI racks quickly approaching 50 kW. These higher densities generate unprecedented heat levels that push traditional HVAC systems to their limits.

Moreover, there’s increasing global pressure on data centers to reduce energy use and carbon emissions. Since cooling can account for up to 40% of a data center’s total energy bill, improving thermal management is no longer optional—it’s essential.

For facility owners, the challenge is balancing three key priorities:

  • Precision: maintaining consistent temperatures at the chip and rack level
  • Scalability: supporting future hardware without major infrastructure overhauls
  • Sustainability: lowering energy use and operating costs while meeting ESG goals

The Rise of Liquid Cooling in AI Data Centers

To meet the growing demands of AI, many operators are turning to liquid cooling, a method that uses water or dielectric fluids to dissipate heat directly from server components. Liquid cooling is roughly 3,000 times more effective than air alone for removing heat from high-density computing environments.

Data centers are adopting one of three strategies:

  • Building new, fully liquid-cooled facilities
  • Retrofitting existing air-cooled spaces to support liquid cooling
  • Integrating hybrid cooling systems that combine both air and liquid methods

Most organizations opt for the hybrid model, as it offers a balanced path to higher capacity, faster deployment, and a better return on investment.

READ MORE: THE FUTURE OF SMART BUILDINGS: DIGITAL TWINS & OCCUPANT-CENTRIC HVAC CONTROL

Direct-to-Chip Cooling: Precision at the Source

Among liquid cooling methods, Direct-to-Chip Cooling stands out as one of the most efficient and scalable solutions. This technology circulates a dielectric coolant directly over the surfaces of processors through specialized cold plates, efficiently removing heat right where it’s generated.

By targeting the heat source (the chips themselves), Direct-to-Chip Cooling:

  • Maintains optimal operating temperatures under any workload
  • Reduces the risk of overheating and downtime
  • Supports higher rack densities without compromising performance
  • Improves system reliability and extends hardware lifespan

This approach is particularly valuable for AI and machine learning systems, where computational intensity can fluctuate dramatically depending on training or inference loads.

Components and Functionality

A typical Direct-to-Chip Cooling system includes:

  • Dielectric coolant: A non-conductive liquid designed for safe, efficient heat transfer
  • Cold plates: Metal interfaces attached to CPUs and GPUs where coolant flows
  • Circulating tubes and pumps: Moving coolant through the system
  • Thermal interface material: Conducting heat from chips to cold plates
  • Coolant Distribution Units (CDUs): Managing flow, pressure, and temperature between racks and facility systems

Direct-to-Chip systems can operate in single-phase (liquid remains in one state) or two-phase (liquid evaporates and recondenses) configurations. Both offer high efficiency, but two-phase systems provide superior heat removal for ultra-dense setups.

Integrating Direct-to-Chip Cooling into Existing Systems

For most existing data centers, transitioning to liquid cooling doesn’t require starting from scratch. Facilities can integrate liquid-to-liquid, liquid-to-air, or liquid-to-refrigerant CDUs into their HVAC systems to establish a dedicated cooling loop for AI racks.

  • Liquid-to-Liquid CDUs isolate the coolant loop from the main chilled water system, offering flexibility and control.
  • Liquid-to-Air CDUs work without chilled water access, using existing air-cooled units for heat rejection.
  • Liquid-to-Refrigerant CDUs connect directly to refrigerant-based systems, maximizing modularity and speed of deployment.

This flexibility allows operators to incrementally add capacity, manage risk, and tailor their approach based on available infrastructure and cooling loads.

READ MORE: AI AND THE ENVIRONMENT: HOW HVAC PLAYS A ROLE IN A SUSTAINABLE FUTURE

Partnering with HVAC Experts for AI Readiness

Implementing advanced cooling technologies like Direct-to-Chip Cooling requires expertise in both mechanical systems and data center operations. That’s where we come in.

As New York City’s premier mechanical contractor, we help facility owners design, maintain, and upgrade their HVAC systems to meet the evolving demands of AI data centers. Our customized maintenance and service agreements are built to minimize downtime, maximize efficiency, and ensure smooth transitions from traditional to next-generation cooling systems.

Whether your facility is exploring liquid cooling retrofits or expanding capacity for AI workloads, our team provides the experience and precision needed to deliver reliable, energy-efficient performance, without disrupting critical operations.

Building the Future of AI Infrastructure

The shift toward AI isn’t slowing down, and neither is the need for smarter, more sustainable cooling. With innovations like Direct-to-Chip Cooling, facility owners can confidently scale their operations, protect their hardware investments, and reduce energy waste.

By partnering with trusted HVAC professionals like us, data center operators can ensure their cooling strategies evolve as rapidly as AI itself. To get your AI Data Center up to speed, contact us today.

FAQ

Direct-to-Chip Cooling is a liquid cooling method that circulates coolant directly over processor chips using cold plates. This removes heat more efficiently than air cooling and supports higher rack densities common in AI data centers.

AI workloads generate far more heat than traditional computing. Liquid cooling offers superior thermal transfer, lowers energy consumption, and enables data centers to run more powerful servers within smaller spaces.

Yes. Facilities can retrofit existing HVAC systems using liquid-to-liquid, liquid-to-air, or liquid-to-refrigerant CDUs. This allows for hybrid setups that integrate with existing air-cooled infrastructure.

Liquid cooling enhances energy efficiency, system reliability, and scalability while reducing total cost of ownership. It also helps organizations meet sustainability targets by cutting power usage.

Donnelly Mechanical provides end-to-end HVAC design, maintenance, and upgrade services for high-density data centers. Our team ensures smooth transitions, custom maintenance plans, and optimal energy performance tailored to each facility’s unique needs.

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